- Material:
Housing: Nylon 46, UL 94V-0 Rated.
Color: Red.
Contact: Brass.
Plating: Gold Plating over Nickel on Contact Area.
Tin Plating on Solder Tail.
Shell(Outside): Brass.
Plating: Nickel Plating.
- eSATA Electrical Specification:
Operation Voltage: 100VAC Max.
Current Rating: 1.5 Ampere per Contact.
Contact Resistance: 30mΩ Max.
Insulation Resistance: 1000MΩ Min.
Dielectric Withstanding Voltage: 500 VAC.
- IEEE 1394 Electrical Specification:
Operation Voltage:40 VAC Max.
Current Rating: 1.5 Ampere per Contact.
Contact Resistance: 30 mΩ Max.
Insulation Resistance: 100 MΩ Min.
Dielectric Withstanding Voltage: 500V AC.
- Environmental:
Operating Temperature: -55°C to +125°C
RoHS Compliance
- eSATA Material:
Housing: Nylon46, UL 94V-0 Rated.
Color: Red.
Contact: Brass.
Plating: Gold plating over Nickel on contact area;
Tin plating on solder Tail.
Shell: SUS304.
Plating: Ni(40u" Min) Plating.
- eSATA Electrical Specification:
Operation Voltage: 100VAC Max.
Current Rating: 1.5 Ampere per Contact.
Contact Resistance: 30mΩ Max.
Insulation Resistance: 1000MΩ Min.
Dielectric Withstanding Voltage: 500 VAC.
- USB Material:
Housing: PBT,UL 94-0 Rated.
Retainer: Nylon 66,UL 94-0 Rated.
Color: Black.
Contact: Phosphor Bronze.
Plating: Gold plating over Nickel on contact area;
Tin plating on solder Tail.
Shell(Inside): SUS304.
Shell(Outside): Brass.
Plating: Ni(40u" Min) Plating.
- USB Electrical Specification:
Rated Voltage and Current: 1.5A at 250VAC Min.
Contact Resistance: 30mΩ Max.
Insulation Resistance: 1000MΩ Min.
Dielectric Withstanding Voltage: 500 VAC for 1Minute.
- Environmental:
Operating Temperature: -55°C to +125°C
RoHS Compliance
- eSATA Material:
Housing: Nylon46, UL 94V-0 Rated.
Color: Red.
Contact: Brass.
Plating: Gold plating over Nickel on contact area;
Tin plating on solder Tail.
Shell: SUS304.
Plating: Ni(40u" Min) Plating.
- eSATA Electrical Specification:
Operation Voltage: 100VAC Max.
Current Rating: 1.5 Ampere per Contact.
Contact Resistance: 30mΩ Max.
Insulation Resistance: 1000MΩ Min.
Dielectric Withstanding Voltage: 500 VAC.
- USB Material:
Housing: Nylon 66,UL 94-0 Rated.
Retainer: Nylon 66,UL 94-0 Rated.
Color: Black.
Contact: Phosphor Bronze.
Plating: Gold plating over Nickel on contact area;
Tin plating on solder Tail.
Shell(Inside): SUS304.
Shell(Outside): Brass.
Plating: Ni(40u" Min) Plating.
- USB Electrical Specification:
Rated Voltage and Current: 1.5A at 250VAC Min.
Contact Resistance: 30mΩ Max.
Insulation Resistance: 1000MΩ Min.
Dielectric Withstanding Voltage: 500 VAC for 1Minute.
- Environmental:
Operating Temperature: -55°C to +125°C
RoHS Compliance
- eSATA Material:
Housing: Nylon46+30% G.F., UL 94V-0 Rated.
Color: Red.
Contact: Phosphor Bronze.
Plating: Gold plating over Nickel on contact area;
Tin plating on solder Tail.
Shell: SUS304.
Plating: Ni(40u" Min) Plating.
- eSATA Electrical Specification:
Operation Voltage: 100VAC Max.
Current Rating: 1.5 Ampere per Contact.
Contact Resistance: 30mΩ Max.
Insulation Resistance: 1000MΩ Min.
Dielectric Withstanding Voltage: 500 VAC.
- USB Material:
Housing: Nylon 66+30% G.F.,UL 94-0 Rated.
Color: Black.
Retainer: Nylon 66+30% G.F.,UL 94-0 Rated.
Color: Black.
Contact: Phosphor Bronze.
Plating: Gold plating over Nickel on contact area;
Tin plating on solder Tail.
Shell(Inside): Brass.
Shell(Outside): Brass.
Plating: Ni(40u" Min) Plating.
- USB Electrical Specification:
Rated Voltage and Current: 1.5A at 250VAC Min.
Contact Resistance: 30mΩ Max.
Insulation Resistance: 1000MΩ Min.
Dielectric Withstanding Voltage: 500 VAC for 1Minute.
- Environmental:
Operating Temperature: -55°C to +125°C
RoHS Compliance
- Material:
Housing: PBT+30%G.F, UL 94V-0 Rated.
Color: Yellow.
Retainer: Nylon66+30%G.F,UL 94V-2 Rated.
eSATA Contact: Brass.
Plating: Gold Plating over Nickel on Contact Area.
Tin Plating on Solder Tail.
IEEE 1394 Contact: Brass.
Plating: Gold Plating over Nickel on Contact Area.
Tin Plating on Solder Tail.
USB Contact: Phosphor Bronze.
Plating: Gold plating over Nickel on contact area;
Tin plating on solder Tail.
Front Shell:SUS301,Nickel Plating.
Back Shell:SUS301.
- eSATA Electrical Specification:
Operation Voltage: 100VAC Max.
Current Rating: 1.5 Ampere per Contact.
Contact Resistance: 30mΩ Max.
Insulation Resistance: 1000MΩ Min.
Dielectric Withstanding Voltage: 500 VAC.
- IEEE 1394 Electrical Specification:
Operation Voltage:40 VAC Max.
Current Rating: 1.5 Ampere per Contact.
Contact Resistance: 30 mΩ Max.
Insulation Resistance: 100 MΩ Min.
Dielectric Withstanding Voltage: 500V AC.
- USB Electrical Specification:
Rated Voltage and Current: 1.5A at 250VAC Min.
Contact Resistance: 30mΩ Max.
Insulation Resistance: 1000MΩ Min.
Dielectric Withstanding Voltage: 500 VAC for 1Minute.
- Environmental:
Operating Temperature: -55°C to +125°C
RoHS Compliance
SATA SPECIFICATION
ELECTRICAL CHARACTER
Contact Current Rating: 1.5 Amps Max. per pin
Contact Resistance: 30Milliohms Max.
Insulation Resistance: 1000Megohms
Dielectric Withstanding Voltage: 500Vrms AC
MECHANICAL CHARACTER
Mating Force: 4.0 kgf Max.
Unmating Force: 4.0kgf Min.
Durability: 500 cycles
Operating Temperature: -55℃~+105℃
USB SPECIFICATION
ELECTRICAL CHARACTER
Contact Current Rating: 1.5 Amps Max. per pin
Contact Resistance: 30Milliohms Max.
Insulation Resistance: 1000Megohms
Dielectric Withstanding Voltage: 500Vrms AC
MECHANICAL CHARACTER
Mating Force: 3.5kgf Max.
Unmating Force: 1.0kgf Min.
Durability: 1500 cycles
Operating Temperature: -55℃~+85℃
Recommended Process:
Wave Solder Peak Up Temperature: 245℃ 5sec
Recommended PCB Thickness: 1.60±0.05mm
MATERIAL
*USB Housing: PBT, UL94V-0, Color: Black
*HDMI Housing: LCP, UL94V-0, Color: Black
*Contact: Copper Alloy
*USB Shell: Stainless Stell
*HDMI Shell: Copper Alloy
PLATING
*USB & HDMI Contact:
Au Plated on contact Area
Tin Plated on Solder Tail Area
Nickel Underplating Overall
*HDMI Shell: Nickel Plated
SPICIFICATIONS
USB
Operating Voltage: 250VAC (RMS) Max.
Current Rating: 1.5A per Contact
Contact Resistance: 30mΩ Max.
Insulation Resistance: 1000MΩ Min.
Dielectric Withstanding Voltage: 750V AC (RMS)
Mating Force: 3.57kgf max.
Unmating Force: 1.02kgf min.
Operating Temperature: -55℃~+85℃
HDMI
Operating Voltage: 40VAC (RMS) Max.
Current Rating: 0.5A per Pontact
Contact Resistance: 30mΩ Max.
Insulation Resistance: 100MΩ Min.
Dielectric Withstanding Voltage: 500V AC (RMS)
Mating Force: 4.5kgf max.
Unmating Force: 1.0kgf min.
Operating Temperature: -55℃~+85℃
SPECIFICATION
ELECTRICAL
Current Rating: 1A per pin
Voltage Rating: 150VAC
Contact Resistance: 50mΩ
Insulation Resistance: 500MΩ
Dielectric Withstanding Voltage:
1KVrms at 60Hz, 1 minute between adjacent contacts
1.5KVrms at 60Hz,1 minute between shield and contacts
MECHANICAL
Durability: 750 Cycle
ENVIRONMENTAL
Operating TemperatureRange: -40℃~+85℃
Storage Temperature Range: -40℃~+85℃
SOLDER ABILITY
Recommended Wave Soldering Temperature: 260℃
Recommended PCB Thickness: 1.2mm
ELECTRICAL
Current Rating: USB 3.0: 1.8A per pin / RJ45: 1A per pin
Voltage Rating: USB 3.0: 30VAC / RJ45: 150VAC
Contact Resistance: 50MΩ
Insulation Resistance: USB 3.0: 100MΩ / RJ45: 500MΩ
Dielectric Withstanding Voltage: USB 3.0: 100VAC / RJ45: 1000VAC
MECHANICAL
Durability: USB 3.0: 1500 Cycle / RJ45: 750 Cycle
Durability: 25 Cycle
ENVIRONMENTAL
Operating temperature range: -40℃~+85℃
Storage temperature range: -40℃~+85℃
SOLDER ABILITY
Recommended Wave Soldering Temperature: 260℃
Recommended PCB Thickness: 1.6mm
MATERIAL
- HOUSING: THERMPOLASTIC (PBT), W/15% G/F, UL94 V-0, BLACK COLOR
- BARREL JACK: THERMPOLASTIC (PBT), W/15% G/F, UL94 V-0, PRANGE COLOR
- BOTTOM COVER: THERMPOLASTIC (PBT), W/30% G/F, UL94 V-0, BLACK COLOR
- SHUTTER: THERMPOLASTIC (PBT), W/15% G/F, UL94 V-0, BLACK COLOR
- CONTACTS: PHOSPHOR BRONZE
- METAL BARREL: BARSS
- FRONT SHIELD: SPCC
- BACK SHIELD: SPCC
- DRIVE IC (TRANSMITTER)/ TX
- DRIVE IC LEAD FRAME: PHOSPHOR BRONZE
FINISH
- CONTACT:
2.54um [100u”] MIN. BRIGHT TIN PLATING OVERALL.
1.27um [50u”] MIN. NICKEL UNDERPLATED OVERALL.
- METAL BARREL:
1.524um[60u”] MIN. NICKEL PLATING OVERALL OR GOLD PLATING.
- BACK SHIELD:
2.54um[100u”] MIN. NICKEL PLATING CN ENTIRE
- FRONT SHIELD:
2.54um [100u”] MIN. BRIGHT TIN PLATING ON ENTIRE.
1.27um [50u”] MIN. NICKEL UNDERPLATED OVERALL.
- LEADFRAME:
2.54um [100u”] MIN. BRIGHT TIN PLATING ON ENTIRE.
1.27um [50u”] MIN. NICKEL UNDERPLATED OVERALL.
WAVE SOLDER CAPABLE TO 265℃
RECOMMENDED PCB THICKNESS: 1.6mm
MATERIAL
- HOUSING: THERMOPLASTIC, W/15% G/F, UL94 V-0, BLACK COLOR
- BOTTOM COVER: THERMOPLASTIC, W/30% G/F, UL94 V-0, BLACK COLOR
- RETAINER: THERMOPLASTIC, W/15% G/F, UL94 V-0, BLACK COLOR
- SHUTTER: THERMOPLASTIC, W/15% G/F, UL94 V-0, BLACK COLOR
- CONTACTS: PHOSPHOR BRONZE
- FRONT SHIELD: BRASS
- BACK SHIELD: BRASS
- COIL SPRING: STAINLESS STEEL
- GROUNDING TAB: STAINLESS STEEL
- DRIVE IC(TRANSMITTER)/ TX
- DRIVE IC LEAD FRAME: PHOSPHOR BRONZE
FINISH
- CONTACT:
GOLD FLASH PLATING ON CONTACT AREA.
100μ” MIN. BRIGHT TIN PLATING ON SOLDER TAIL AREA.
50μ” MIN. NICKEL UNDERPLATING OVERALL.
- BACK SHIELD:
100μ” MIN. NICKEL PLATING CN ENTIRE
50μ” MIN. Cu UNDERPLATING OVERALL
- FRONT SHIELD:
100μ” MIN.TIN PLATING ON ENTIRE
50μ” MIN. NICKEL UNDERPLATING OVERALL
- LEADFRAME:
100μ” MIN. TIN PLATING ON ENTIRE
50μ” MIN. NICKEL UNDERPLATING OVERALL
RECOMMENDED PCB THICKNES: 1.6 mm