Material:
Housing: High temperature thermoplastic
Contact: Copper Alloy
Shell: Copper Alloy
Plating:
Contact Area: Gold Plated Over Ni
Solder Tail: 100µ" Min An/Pb Plated Over Ni.
Shell Solder Area: Gold Plated Over Ni.
Rating:
Current Pating: 0.5A
Voltage Rating: 250V RMS.
Operating Temperature: -25℃ ~90℃
Specification:
Contact Resistance: 40 MegOHMS
Dielectric Withstandingf Voltage: 500VAC MegOHMS
Insulation Resistance: 100 MegOHMS
MATERIAL
Housing:High temperature thermoplastic
UL 94V-0,Color:Black
Contact:Copper Alloys
Cover:Stainless steel
Plating
Underplate:Nickel
Contactarea:Gold over nickel
Solder area:Tin/Lead or unlead over nickel
MATERIAL
Insulator: LPC UL94V-0
Contacts: Copper Alloy
Shell: Copper Alloy
CONTACT PLATING
Underplated: 50u" Nickel
Contact Area: 15u" Gold Plating
Solder Tails Area: 100u" Tin/Lead Free
ELECTRICAL
Current Rating: 1 Amps Max.
Contact Resistance: 100 mohms Max.
Insulation Resistance: 1000 Mohms Min @ 500 VDC
MECHANICAL
Mating Cycles: 10000 Cycles
Operating Temperature: -25℃ to +85℃
Material
Insulator: LCP+G.F UL 94V-0 rated, Color Black
Contact: Phosphor Bronze
Shield Cover: Stainless steel sheet metal, SUS304, 0.2t.
Contact Plating
Contact Area: Gold Plating over 1.27um (50u") min Ni underplate.
Soldering Zone: 3.5um (120u")min sn,over 1.27um (50u") min. Ni. underplate.
INSULATOR
Plastic Body : LCP+35%GF, Color Black.
Slider : LCP+35%GF, Color Black.
CONTACT
Contact : Phosphor Bronze Alloy (C5210R–EH)
Switch A/C :Phosphor Bronze Alloy (C5210R–EH)
Hold down :Phosphor Bronze Alloy (C5191R–H).
Contact area: Gold 10 micro inches (Min.)
Solder area: Gold flash
All under-plated Ductile Nickel 50 micro inches (Min.)
Switch A/C & Hold down:
Contact area: Gold flash,Solder area: Gold flash
All under-plated Ductile Nickel 50 micro inches (Min.)
SHELL OR COVER
Shell :SUS304R-3/4 H
Latch : SUS304R-3/4 H
Spring : Piano Wire
Drag Link : SUS304
OTHERWISE SPECIFIED
Operating Temperature: -25℃to +90℃
Storage Temperature: -40℃to +90℃
Ambient Humidity: 90%~95% R.H.
ELECTRICAL
Current Rating: 0.5A per pin
Voltage Rating: 100V AC/DC
Contact Resistance: 80mΩ
Insulation Resistance: 1000MΩ Min.
Dielectric Withstanding Voltage: 500VAC
MECHANICAL
Durability: 10,000 Cycles
Card Insertion / Eject Force: 9.8N Max.
ENVIRONMENTAL
Operating temperature range: -25℃~+90℃
Storage temperature range: -40℃~+90℃
SOLDER ABILITY
Recommended IR Reflow Temperature: 260℃ 10Sec
MATERIAL
Insulator: LCP+30% G.F., UL 94V-0 Rated Color: Black
Contact: Phosphor Bronze, 0.25t
PLATING
Contact Area: Gold plating over 50u”Nickel underplating
Soldering Zone: 100%TIN over 50u”min. Ni underplated overall.
Au Contact Area: 10u” Gold Plating.
Inspection Dimension: Critical
This soldering pad is optional and shall be grounding.
Insertion Force: 15N max.
Extraction Force: 0.15N min.
Card Retention Force: 688g max. Avrg: 543g
MATERIAL
Insulator: LCP, UL 94V-0
Contact: Phosphor Bronze Alloy
PLATING
Contact Area: 10u" Gold Plated, under- plated Ductile Nickel
Solder Area: Gold Flash
Contact Area: 10u” Gold Plating.
ELECTRICAL
Contact Resistance: 80 mΩ Max
Insulation Resistance: 1000 MΩ Min
Rating Current: 0.5A
Rating Voltage: 100V AC/DC